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| Chip LEDs sSEC1001 series (Unicolor flat type) Outline drawing A 1.4 1.5 Cathode mark (Blue) 0.9 (0.5) 1.3 3.0 2.0 1.5 Resin Substrate sSEC2002 series (Bicolor flat type) Outline drawing B 1.4 2.5 Cathode mark (Blue) 0.9 (0.5) 0.6 0.9 3.0 2.0 1.5 1 2 Resin Substrate sSEC1003 series (Unicolor inner lens type) Outline drawing C 1.5 1.4 1.3 3.0 2.0 1.7 Lens Substrate sSEC2004 series (Bicolor inner lens type) Outline drawing D 2.5 1.4 0.6 0.9 3.0 2.0 1.5 1 2 Lens Substrate sExternal dimensions: Unit: mm Tolerance: 0.2 32 1.0 1.0 1.6 1.0 Chip Chip 1.0 1.6 Viewing angle SEC1001 0 30 30 60 30 SEC2002 0 30 60 60 60 90 100% 50 * 1/2 = 72 * 50 90 100% 90 100% 50 * 1/2 = 70 * 50 90 100% SEC1003 0 30 30 60 60 30 SEC2004 0 30 60 60 90 100% 50 * 1/2 = 35 * 50 90 100% 90 100% 50 * 1/2 = 30 * 50 90 100% Absolute maximum ratings (Ta=25C) Symbol Unit IF mA IFP mA VR V Top C Tstg C Ratings 30 70 4 -30 to +85 -30 to +90 Electro-optical characteristics (Ta=25C) Type No. Emitting color typ Red High intensity red Ultra-high intensity red Green Pure green Amber Orange Green High intensity red Green Ultra-high intensity red High intensity red Green Ultra-high intensity red High intensity yellow Green High intensity red Green Ultra-high intensity red High intensity yellow Ultra-high intensity red 2.0 1.9 1.7 2.0 1.9 2.0 1.9 2.0 1.7 1.9 2.0 1.7 2.0 2.0 1.9 2.0 1.7 2.0 1.7 VF (V) F L A T T Y P E SEC1101C SEC1201C SEC1601C SEC1401C SEC1501C SEC1801C SEC1901C SEC2422C SEC2462C 1 2 1 2 I N N E R L E N S T Y P E SEC1203C SEC1403C SEC1603C SEC1703C SEC2424C SEC2464C SEC2764C 1 2 1 2 1 2 IV IR Condition (A) Condition (mcd) Condition IF VR IF max (mA) max typ (mA) (V) 1.2 2.5 7.0 2.2 60.0 15.0 10 100 4 20 2.5 6.5 14.5 2.5 10.0 15.0 2.5 9.0 10 100 4 20 15.0 2.2 14.0 18.0 2.5 20.0 20 10 100 4 120.0 2.2 30.0 2.5 20.0 20.0 2.5 20.0 20 10 100 4 30.0 2.2 30.0 2.5 30.0 2.2 p Outline drawing (nm) typ 700 630 660 560 555 610 587 560 630 560 660 630 560 660 570 560 630 560 660 570 660 100 35 30 20 20 35 33 20 35 20 30 35 20 30 40 20 35 20 30 40 30 A B C D 33 sTaping specifications (Unit: mm) Reel Unicolor SEC1001/ SEC1003 series 1.75 +0.1 0.20.05 o1.5 0 o180 -3 Label P/N, Manufacturing Date Code No, Q' ty +0 11.4 9.0 1.0 0.3 Cathode 3.50.05 8.0 2.00.2 o130.2 1.9 4.0 2.00.05 4.0 o60-0 +1 Bicolor SEC2002/SEC2004 series 1.75 30 o10 o22 0.2 0.05 o1.5+0.1 0 Cathode 3.50.05 8.0 Tolerance 0.2 1.9 4.0 2.00.05 4.0 Quantity: 3,000 pcs./reel Recommended soldering conditions 1 Reflow soldering Surface temperature of components (C) 240max 150max 5 sec. 120 sec. sMoisture-proof packing of chip LEDs 1. Effects of moisture absorption qSanken chip LEDs are designed for surface mounting (SMD). However, interfacial separation may occur during dip soldering, depending on the moisture absorption of the resin. This phenomenon is commonly called "Popcorn effect." It is caused by vaporization of the resin's absorbed moisture due to sudden thermal change, and cause interfacial separation. qInterfacial separation may affect the light transmission efficiency, causing the light intensity to drop. 2. Moisture-proof packing qTo minimize moisture absorption before use, Sanken bakes the chip LEDs and packs them in moisture-proof packing. qLaminated aluminum, which has high moisture-resistance, is used for the moisture-proof packing. qFor additional protection against moisture absorption, silica gel is added to each packing. 3. Storage period after unpacking qThe chip LEDs must be dip-soldered within seven days after opening the moisture-proof packing. 4. Storage of unused chip LEDs qRepack unused chip LEDs with their moisture-proof packing, fold to close any opening and then store in a dry place. 2 Dip soldering Surface temperature of components (C) Hardening of adhesive 150max 120 sec. Room temperature Dip 260max Pre-heating 120max 30 sec. Time 5 sec. 3 Manual Soldering: Not more than 3 seconds at MAX 300C, under soldering iron. Time Recommended land layout (Unit: mm) 1001 Unicolor SEC 1003 series 1.7 2002 Bicolor SEC 2004 series 1.4 1.4 0.5min 2.2 2.2 1.5min 34 2.2 0.9min 2.2 |
Price & Availability of SEC2764C
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